WebGlass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. [1] This technique utilizes low melting-point glass ("glass solder") and ... WebThe linear thermal expansion coefficient (CTE) is dependent on the material from which an object is made. Generally, linear thermal expansion is most applicable to solids. The CTE employs reciprocal temperature units (K-1, °F-1, °C-1, etc.) representing the length change per degree per unit length, e.g., in./in./°F or mm/mm/°C. The table at ...
Glass frit bonding - Wikipedia
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